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半导体50(512760)融资融券信息(04-08)-背水一战的主人公是谁

半导体50(512760)2020-04-08融资融券信息显示,半导体50融资余额816,973,616元,融券余额27,568,138.719元,融资买入额121,253,414元,融资偿还额143,502,711元,融资净买额-22,249,297元,融券余量14,486,673股,融券卖出量4,138,600股,融券偿还量1,372,600股,融资融券余额844,541,754.719元。半导体50融资融券详细信息如下表:交易日期代码简称融资融券余额(元)2020-04-08512760半导体50844,541,754.719融资余额(元)融资买入额(元)融资偿还额(元)融资净买额(元)816,973,616121,253,414143,502,711-22,249,297融券余额(元)融券余量(股)融券卖出量(股)融券偿还量(股)27,568,138.71914,486,6734,138,6001,372,600沪市全部融资融券数据一览 半导体50融资融券数据

半导体50(512760)融资融券信息(04-08)